Cooling Environments/Door Heat Exchanger

Welcome

Welcome to the OCP Door Heat Exchanger Sub-Project.

This Project is open to the public and we welcome all those who would like to be involved.

The Door Heat Exchanger (DHX) Sub-Project is a critical component of the Open Compute Project's (OCP) broader effort to standardize advanced cooling solutions in data centers, particularly in high-performance computing environments. This sub-project focuses on the development, integration, and standardization of Rear Door Heat Exchangers (RDHX) within the ORV3 (Open Rack Version 3) framework. RDHX systems are designed to enhance cooling efficiency by utilizing liquid cooling technology to manage the thermal load of high-density IT equipment, thereby improving energy efficiency and operational reliability in modern data centers.

The ongoing work in this project involves collaboration between key industry players . These organizations are working together to address various challenges associated with RDHX implementation, including the development of standardized interfaces, ensuring compatibility with existing data center infrastructure, and mitigating risks such as fluid leaks and equipment failure. The project aims to produce comprehensive guidelines and specifications that will be shared through white papers and industry presentations, helping to drive the adoption of RDHX systems across the industry.

Summary of Current Workstreams

1. RDHX Interfaces for ORV3:

This workstream focuses on defining the mechanical, fluid, and electrical interfaces required for integrating RDHX systems with ORV3 racks. The effort addresses challenges such as ensuring compatibility with existing rack designs, preventing fluid leaks, and maintaining system reliability. The outcomes of this workstream include the standardization of interfaces to support various configurations, including hybrid systems that combine liquid and air cooling.

2. Aluminum Heat Exchanger Integration:

Led by a collaboration between OVHCloud, Meta, and Valeo, this workstream aims to overcome the challenges associated with using aluminum in heat exchangers, particularly the risk of corrosion. The team is developing standards for internal linings, coatings, and compatible coolants to enhance the performance and durability of aluminum heat exchangers in data center environments. This workstream will produce guidelines that address integration techniques, testing methodologies, and recommendations for widespread adoption.

3. Air-Assisted Liquid Cooling (AALC) with Sidecar Cooling:

This workstream explores the implementation of Air-Assisted Liquid Cooling (AALC) systems, which combine the efficiency of liquid cooling with the simplicity of air cooling. The focus is on developing sidecar units that attach to or are positioned adjacent to the IT racks, providing flexible and scalable cooling solutions without the need for access to facility water. The team is working on standardizing performance metrics, interface designs, and ensuring the maintainability and reliability of these systems in various data center configurations.

Scope

The scope of the Door Heat Exchanger Sub-Project is focused on several key areas that are essential for the successful deployment and integration of RDHX systems within data centers. These include:

In-Scope Activities:

Fluid Characteristics and Compatibility: Defining the types of fluids and their properties that are suitable for use in RDHX systems, ensuring compatibility with existing data center cooling infrastructure and optimizing heat transfer efficiency. Operational Parameters: Establishing guidelines for the operating conditions of RDHX systems, including temperature ranges, flow rates, and pressure levels, to ensure reliable performance across various data center environments. Heat Extraction Metrics: Developing standardized methods for measuring the effectiveness of RDHX systems in extracting heat, which is critical for assessing system performance and energy efficiency. System Integration: Creating solutions that allow RDHX systems to be integrated seamlessly into both traditional and modern data center environments, whether they use air cooling, liquid cooling, or a combination of both (hybrid systems). Interface Standardization: Standardizing the mechanical, fluid, and electrical interfaces required for RDHX systems to function effectively with ORV3 racks and other components, facilitating easier deployment and maintenance.

Out-of-Scope Activities:

This project does not cover detailed installation methods for cold plates or the broader definitions of data center facility loops beyond the direct rack interfaces. The focus remains on rack-level integration and the specific challenges related to RDHX systems. This sub-project is crucial for advancing the adoption of liquid cooling technologies within the data center industry. By focusing on standardization and the development of robust guidelines, the project aims to ensure that RDHX systems are not only effective but also widely compatible with various data center configurations, supporting the industry's move towards more sustainable and efficient cooling solutions.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Project Leadership

John Fernandes (Meta)

Rack & Power Project Incubation Committee Representative

Steve Mills (Meta)

Rack & Power Project Leads

Caleb Lusk (Rittal)
Hamid Keyhani (Facebook)

Door Heat Exchanger Workstream Leads

Jabari George (Independent)
Ann-Kathrin Dechert (Rittal)

Documents

- ACS Charter

- Meeting Minutes (Working Doc)

- OCP Presentation Template - please contact Michael Schill for a copy

ACS Door Heat Exchanger Workstream Work in Progress Documents

- ACS Door HEX Options Presentation

- High-Power GPU Rack Concept presentation

- Working OCP Specification

- ACS Door Heat Exchanger Requirements Document for Open Rack Revision .95

Get Involved

If you would like to get more involved in the project, please sign-up on the mailing list. This is the primary method that we use to communicate project status, meeting schedules, and agendas.

- ACS Mailing List

- ACS Door Heat Exchanger Mailing List