Server/MHS/DC-SCM-Specs-and-Designs

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Welcome

Welcome to the OCP Datacenter Secure Control Module Specification (DC-SCM) Workstream. This is a workstream under Server/MHS Sub-project Server/MHS

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Charter

This Workstream creates designs and specifications to enable interoperable hardware for platform Security and Manageability, in the form of standardized DC-SCM Module. Deliverables from this project will include:

  • Specification for the Datacenter Secure Control Interface (DC-SCI) between the DC-SCM Module and Host Processor Module (HPM)
  • Electrical, Mechanical, Functional and Logical requirements for platform designers
  • Design specifications for interoperable DC-SCM and HPM modules

Workstream Overview

The DC-SCM module specification separates the common platform management and security hardware and places them behind a connector. The module is specified by its connector pin-out called DC-SCI. The module may have one or more form-factors.

Workstream Leadership

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Active Documents and Specs

Note: Documents published below are either Final Release Candidates or early versions posted for public review and feedback. The final versions of specifications are published in the Contribution Database after Final Specification Agreements (FSA) are signed.

Type Description Revision Submit Date Contributor License Notes
Specification OCP DC-SCM 2.1 VFF Drawings


OCP DC-SCM Rev 2.1 Ver1.1

OCP DC-SCM Rev 2.1 Ver1.1 Errata 1

OCP DC-SCI Rev2.1 Ver1.1

OCP DC-SCM LTPI Rev2.1 Ver1.1

2.1 June 28, 2024 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated November 2024
Specification OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 1.0


OCP HPM Common Circuit Type 1 Spec Rev 1.0 Ver 1.0

1.0 August 21, 2024 Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Jabil Inc.; Microsoft Corporation; Nuvoton Technology Israel Ltd. Modified OWFa 1.0 CLA (modified 07/2021) last updated September 2024
Specification OCP HPM Common Circuit Type 2 Pinlist Ver 0.3.0


OCP HPM Common Circuit Type 2 System Diagrams Ver 0.3.0

0.3.0 October 10, 2024 AMD, ASPEED, Dell, HPE, IBM, Intel, Jabil, Lenovo, Nuvoton Modified OWFa 1.0 CLA (modified 07/2021)
Specification OCP DC-SCM Rev2.0 ver1.0 specification candidate


OCP DC-SCI Rev2.0 ver1.0 candidate

OCP DC-SCM Rev2.0 Security Considerations candidate

OCP LTPI specification ver1.0 specification candidate

OCP DC-SCM Rev2.0 mechanical files candidate

2.0 July 27, 2022 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated July 2022
Approved by IC
Specification OCP DC-SCM Rev 1.0_release_to_OCP.pdf


OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf

OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf

1.0 3/26/2021


12/02/2020

11/10/2020

Microsoft & Google OWFa 1.0 CLA 05/26/2021
* approved by IC, available on the contributions portal

03/26/2021
* For submitting into the contribution database
12/02/2020
* For review in November IC calls
11/11/2020
* For review in November Server and HW-MGMT project calls

Reference Designs and Implementations

Type Description Version Submit Date Contributor License Notes
Reference Design DC-SCM 2.0 Reference Design following DC-SCM 2.0 Specification

DC-SCM 2.0 Custom 1U VFF
DC-SCM 2.0 Custom 1U VFF Design Collaterals

v1.0 10/15/2023 Axiado - Product available in Marketplace
Reference Design DC-SCM 2.0 Reference Design following DC-SCM 2.0 Specification

DC-SCM 2.0 HFF
DC-SCM 2.0 HFF Design Collaterals

v1.0 5/15/2023 Lenovo, Cloudflare - Product available in Marketplace
Reference implementation DC-SCM LTPI IP Reference Implementation
Github Repository
v1.0 3/3/2023 Intel MIT Approved
Reference Design DC-SCM 1.0 Reference Design following DC-SCM 1.0 Specification

DC-SCM 1.0 HFF
DC-SCM 1.0 HFF Design Collaterals
DC-SCM 1.0 VFF
DC-SCM 1.0 VFF Design Collaterals
DC-SCM 1.0 ROT
DC-SCM 1.0 ROT Design Collaterals

v1.0 5/26/2022 AMD - Approved


DC-SCM 2.0 Workgroup

Public Meetings

The DC-SCM Workstream provides public updates at MHS Monthly Public Meeting Refer to MHS Public Meetings Calendar

Presentations

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