The Open Compute Project held a series of engineering workshops on September 25th, 2017 co-located with the DCD Colo & Cloud event in Dallas TX.
The videos and presentations from this event are now live!
Datacenter
Agenda:
|
Welcome |
Robert Bunger, (OCP Project Lead) Schneider Electric |
|
Review of Colocation Facility Guidelines for OCP Racks |
Robert Bunger, (OCP Project Lead) (Schneider Electric |
|
Colocation Facility Assessment Process |
Robert Bunger, (OCP Project Lead) Schneider Electric |
|
Comparing an OCP data center using Romonet Site Analysis Tool (Slides) |
Zahl Limbuwala, Romonet |
|
Color Coded Cabling Proposal (Slides) |
Michael Bailey, Fidelity |
|
Liquid Cooled Data Center Review - Alibaba (Slides) |
David Wu, Alibaba |
Hardware Management
Agenda:
|
Welcome and General update |
Bernie Meier (Ericsson) and Norman James (IBM), OCP Project Co- Leads With John Leung (Intel), Incubation Committee Representative |
|
Panel Discussion on OpenBMC
|
Bill Carter (OCP CTO), Chris Austen (IBM), Sai Dasari (Facebook), John Leung (DMTF), James Mihm (Intel), Rick Altherr (Google), Bryan Kelly (Microsoft) Moderator: Archna Haylock, OCP Community Director |
|
OpenBMC @ IBM (Slides) |
Norman James (IBM), Chris Austen (IBM) |
|
OpenBMC @ Microsoft (Slides) |
Ali Larijani (Microsoft) |
|
OpenBMC @ Facebook (Slides) |
Eran Tal, OCP IC Vice-Chair (Facebook), Sai Dasari (Facebook) |
|
OpenBMC @ Intel (Slides) |
James Mihm (Intel) |
|
OpenBMC @ Google |
Rick Altherr (Google) |
|
Redfish OCP Interoperability Profile Review (Slides) |
Jeff Autor (HPE) |
Rack & Power
Agenda:
|
Welcome (Slides) |
Steve Mills, OCP Rack and Power Project Co-lead (Facebook) |
|
Open Rack Standard V2 specification proposal: ‘Independent Busbar’ (Amphenol Slides) (Rittal Slides) |
Derek Winsor, (Rittal) Michael Wingard, (Amphenol) Justin Knott Field, (Amphenol) |
|
BarKlip 48V IT Gear Connector (Slides) |
Skip Fry, (Amphenol) |
|
Review Proposed Changes to Open Rack Specification 2.0: (Slides) |
Steve Mills, OCP Rack and Power Project Co-lead (Facebook) Antony Ren, (Delta Electronics) |
|
Review Specification Proposal: True 3-phase 380 – 480 Vac to 48Vdc Power Shelf (Slides) |
Paul Smith, (GE Industrial Solutions) |
|
Overview of Flatpack-: Adapting 12V IT gear to 48V Open Rack (Slides) |
Nate Klein, (Google) Scott McCauley, (Google) |
|
Community Driven Discussion of the Power Shelf Specification Roadmap |
Steve Mills, OCP Project Co-lead (Facebook) |
Server & Mezz Card
Agenda:
|
Welcome and General update |
Jia Ning, Facebook |
|
Project Olympus update (Slides) |
Mark Shaw, Microsoft |
|
Overview of OCP NIC 3.0 status (Slides) |
Jia Ning, Facebook |
|
Mezz 3.0 Specification - Thermal considerations (Slides) |
John Fernandes and Yueming Li, Facebook |
|
Mezz 3.0 Specification - Mechanical update (Slides) |
Joshua Held, Facebook |
|
Mock-up review and demo |
Joshua Held, Facebook |
|
Connector Update (Slides) |
TE |
|
Connector Update (Slides) |
Amphenol |
|
Dell – EMC update (Slides) |
Jon Lewis, Dell-EMC |
|
Pinout discussion (Slides) |
Jia Ning, Facebook |
|
NIC Management (Slides) |
Hemal Shah, Broadcom |
Telco
Agenda:
|
Welcome (Slides) |
Tom Anschutz, OCP Incubation Committee Representative (AT&T) |
|
PON XGS Spec (Slides) |
Tom Anschutz, OCP Incubation Committee Representative (AT&T) |
|
XGS Design & Device (Slides) |
Jeff Catlin (Accton/Edgecore) |
|
GPON - NGPON2 Interest (Slides) |
Tom Anschutz, OCP Incubation Committee Representative (AT&T) |
|
Use of FPGAs (Slides) |
Tom Anschutz, OCP Incubation Committee Representative (AT&T) |
|
AT&T 24 Port PON Spec (Slides) |
Sumitra Bhojan (AT&T) |
|
PON Fiber Distribution Hub (Slides) |
Earl Pope (AT&T) |
|
G.fast 16 Port DPUs: Sckipio, Broadcom (Slides) Common Wiring Adaptation Module (Slides) |
Sumitra Bhojan (AT&T) |
|
G.fast Single Port DPU (Slides) |
Mark Shostak (AT&T) |
|
UCPE Update on spec (Slides) |
John Gibbons (AT&T) |
|
UCPE Expansion Card (Slides) |
John Gibbons (AT&T) |
|
UCPE x86 Next steps (Slides) |
John Gibbons (AT&T) |
|
Accton/Edgecore UCPE (Slides) |
Jeff Catlin (Accton/Edgecore) |
|
Silicom-USA UCPE (Slides) |
Steve Yates |
|
UCPE Arm Spec (Slides) |
Tom Anschutz, OCP Incubation Committee Representative (AT&T)/John Gibbons (AT&T) |
|
ARM/SOC Presentation (Slides) |
Bob Monkman (ARM), Manya Rastogi (NXP) |
|
UCPE Arm Device (Slides) |
Guy Ellis (Traverse) |
|
TIP Engagement (Slides) |
Martin Rehwald (TIP) |
|
Close |
Tom Anschutz, OCP Incubation Committee Representative (AT&T)/ Archna Haylock, OCP Community Director |